A Cost-Effective W-Band Antenna-in-Package Using IPD and PCB Technologies

被引：8

作者：

Chiang, Ching-Wen ^{[1
]}

Wu, Chung-Tse Michael ^{[2
]}

Liu, Nai-Chen ^{[3
]}

Liang, Chia-Jen ^{[1
,4
]}

Kuan, Yen-Cheng ^{[1
]}

机构：

[1] Natl Yang Ming Chiao Tung Univ, Int Coll Semicond Technol, Hsinchu 30010, Taiwan

[2] Rutgers State Univ, Elect & Comp Engn Dept, New Brunswick, NJ 08854 USA

[3] Natl Yang Ming Chiao Tung Univ, Inst Commun Engn, Hsinchu 30010, Taiwan

[4] Natl Yang Ming Chiao Tung Univ, Inst Elect Engn, Hsinchu 30010, Taiwan

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 2022年 / 12卷 / 05期

关键词：

Substrates; Metals; Silicon; Antenna measurements; Antennas; Antenna radiation patterns; Packaging; Antenna-in-package (AiP); bumps; cavity antenna; flip-chip; grounded coplanar waveguide (GCPW); heterogeneous integration (HI); integrated passive device (IPD); millimeter-wave (mmWave); printed circuit board (PCB); substrate-integrated waveguide (SIW); W-band; ARRAY;

D O I：

10.1109/TCPMT.2022.3170499

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This article presents a cost-effective millimeter-wave (W-band) cavity-backed slot antenna-in-package (AiP) built using commercially available integrated passive device (IPD), printed circuit board (PCB), and flip-chip assembly technologies. An IPD-PCB resonant cavity is formed by flipping an IPD chip on a PCB substrate with surrounding solder bumps to provide radiation through a square slot, which is patterned on one of the IPD metal layers. Moreover, a substrate-integrated waveguide (SIW) cavity under the IPD-PCB cavity and a wideband-grounded coplanar waveguide (GCPW) are built in the PCB substrate for the transition between a radio frequency front-end (RFFE) and the IPD-PCB cavity. The fabricated AiP achieves a 3.75-dBi gain at 94.5 GHz (TE210 mode) and a 10-dB impedance bandwidth of 1.9 GHz with a 3.61 mm(2) IPD chip area.

引用

页码：822 / 827

页数：6

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