Influence of electrically conductive adhesive amount on shear strength of glued joints

被引：0

作者：

Hirman, Martin ^{[1
]}

Steiner, Frantisek ^{[1
]}

机构：

[1] Univ W Bohemia, Fac Elect Engn, Dept Technol & Measurement, Plzen, Czech Republic

来源：

2015 INTERNATIONAL CONFERENCE ON APPLIED ELECTRONICS (AE) | 2015年

关键词：

Electrically conductive adhesive; shear strength test; curing profile;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper deals with the influence of electrically conductive adhesive amount on shear strength of joints glued by EPO-TEK (R) H20S and MG 8331S. These joints were made by gluing of chip resistors 1206, 0805 and 0603 with two curing profiles for each adhesive. The different thickness of stencils and reductions of the hole in stencils were used. These differences have an effect on the amount of conductive adhesives on the samples. The curing profiles and various amounts of the adhesives have an effect on the mechanical strength of the joint. Samples were measured after curing process by using shear strength test with the device LabTest 3.030.

引用

页码：53 / 56

页数：4