Present problems of power module packaging technology

被引：89
作者：
Shammas, NYA [1 ]
机构：
[1] Staffordshire Univ, Sch Engn & Adv Technol, Stoke On Trent ST18 0DF, Staffs, England
来源：
MICROELECTRONICS RELIABILITY | 2003年 / 43卷 / 04期
关键词：
SEMICONDUCTOR-DEVICES;
D O I：
10.1016/S0026-2714(03)00019-2
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
An overview of the problems encountered concerning power module performance and reliability is given and the main failure mechanisms are discussed. Experimental and simulation methods for the transient thermal characterisation of semiconductor packages are presented. An identification procedure that allows establishing the physical correspondence between the RC cells of the thermal model and the layers that constitute the electronic package is proposed. The results of tests on a number of commercial Smartpack(R) modules provide useful information about the influence of materials properties and geometry on the step response. These could be used for package quality control and reliability investigations. (C) 2003 Elsevier Science Ltd. All rights reserved.
引用
收藏
页码：519 / 527
页数：9
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