Computational modeling of spray cooling: Current status and future challenges

被引:0
|
作者
Selvam, RP [1 ]
Lin, LC [1 ]
Ponnappan, R [1 ]
机构
[1] Univ Arkansas, BELL 4190, Fayetteville, AR 72701 USA
来源
SPACE TECHNOLOGY AND APPLICATIONS INTERNATIONAL FORUM-STAIF 2005 | 2005年 / 746卷
关键词
BOILING HEAT-TRANSFER; NUMERICAL-SIMULATION; PRESSURES; FLOWS; DROP;
D O I
暂无
中图分类号
V [航空、航天];
学科分类号
08 ; 0825 ;
摘要
A survey on the current status of computational modeling of spray cooling is reported. From the survey, it is inferred that modeling heat transfer of the spray on thin liquid film on a hot surface will help one to understand and improve the performance of spray cooling. The computer modeling of multiphase flow using the level set method to identify the interface of vapor and liquid is presented. Computed velocity vector and temperature contour diagram are plotted for a thin liquid film of 73.62 mu m. The transient Nu on the heated wall is plotted. From that the importance of transient conduction in the liquid film. leading to high heat flux in a short time is identified. The mechanics of spray cooling is explained from the modeling study.
引用
收藏
页码:55 / 63
页数:9
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