Optical characterization of lattice damage and recovery in ion-implanted and pulsed excimer laser irradiated 4H-SiC

被引:5
作者
Sands, D [1 ]
Key, PH
Schlaf, M
Walton, CD
Anthony, CJ
Uren, MJ
机构
[1] Univ Hull, Dept Phys, Hull HU6 7RX, N Humberside, England
[2] DERA Def Res & Evaluat Agcy, Malvern WR14 3PS, Worcs, England
来源
SILICON CARBIDE AND RELATED MATERIALS - 1999 PTS, 1 & 2 | 2000年 / 338-3卷
关键词
contact preparation; infrared; laser annealing; lattice recovery; reflectivity; Reststrahlen band;
D O I
10.4028/www.scientific.net/MSF.338-342.655
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Infrared reflection measurements at near normal incidence between 400-7800 cm(-1) have been performed on ion-implanted and excimer laser irradiated bulk 4H-SiC wafers. A simulated annealing algorithm was used to fit a Lorenz-Drude model to the Reststrahlen region. The parameters of this model are directly related to the structure and electronic properties of the material. By examining the real and imaginary parts of the refractive index we are able to observe both damage induced by ion-bombardment and lattice recovery induced by excimer laser irradiation. The optimum laser fluence for lattice recovery is close to 1 J cm(-2), after which the laser appears to damage the SiC surface. Ultraviolet/visible reflectivity and photoluminescence provide additional evidence of an optimal annealing fluence. A consequence of the modeling is the deduction of estimates for the plasma frequency and carrier densities in annealed material.
引用
收藏
页码:655 / 658
页数:4
相关论文
共 13 条
[1]  
BARANOV SV, 1982, INORG MATER+, V18, P1097
[2]   High temperature electronics using SiC: Actual situation and unsolved problems [J].
Chelnokov, VE ;
Syrkin, AL .
MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, 1997, 46 (1-3) :248-253
[3]   THIN-FILM DEPOSITION AND MICROELECTRONIC AND OPTOELECTRONIC DEVICE FABRICATION AND CHARACTERIZATION IN MONOCRYSTALLINE ALPHA AND BETA SILICON-CARBIDE [J].
DAVIS, RF ;
KELNER, G ;
SHUR, M ;
PALMOUR, JW ;
EDMOND, JA .
PROCEEDINGS OF THE IEEE, 1991, 79 (05) :677-701
[4]   INFRARED-SPECTROSCOPY OF OXIDE LAYERS ON TECHNICAL SI WAFERS [J].
GROSSE, P ;
HARBECKE, B ;
HEINZ, B ;
MEYER, R ;
OFFENBERG, M .
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 1986, 39 (04) :257-268
[5]   COHERENT AND INCOHERENT REFLECTION AND TRANSMISSION OF MULTILAYER STRUCTURES [J].
HARBECKE, B .
APPLIED PHYSICS B-PHOTOPHYSICS AND LASER CHEMISTRY, 1986, 39 (03) :165-170
[6]   SiC material for high-power applications [J].
Janzen, E ;
Kordina, O .
MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, 1997, 46 (1-3) :203-209
[7]   THE EFFECTS OF N+ DOSE IN IMPLANTATION INTO 6H-SIC EPILAYERS [J].
KIMOTO, T ;
ITOH, A ;
MATSUNAMI, H ;
NAKATA, T ;
WATANABE, M .
JOURNAL OF ELECTRONIC MATERIALS, 1995, 24 (04) :235-240
[8]  
LLIADIS AA, 1998, APPL PHYS LETT, V173, P3545
[9]  
Mitra S.S., 1985, HDB OPTICAL CONSTANT, P213, DOI DOI 10.1016/B978-0-08-054721-3.50016-2
[10]  
MITRA SS, 1985, HDB OPTICAL CONSTANT, P547