Optimization of selective laser-induced etching (SLE) for fabrication of 3D glass microfluidic device with multi-layer micro channels

被引:37
|
作者
Kim, Sungil [1 ,2 ]
Kim, Jeongtae [1 ]
Joung, Yeun-Ho [1 ]
Ahn, Sanghoon [2 ]
Choi, Jiyeon [2 ]
Koo, Chiwan [1 ]
机构
[1] Hanbat Natl Univ, Dept Elect & Control Engn, 125 Dongseodaero, Daejeon 34158, South Korea
[2] Korea Inst Machinery & Mat, Dept Laser & Electron Beam Applicat, 156 Gajeongbuk Ro, Daejeon 34158, South Korea
基金
新加坡国家研究基金会;
关键词
Glass micromachining; 3D laser micromachining; Selective laser-induced etching; Subtractive manufacturing; 3D microchannel; Glass microfluidic device; FUSED-SILICA; WAVE-GUIDES; MICROFABRICATION; INTEGRATION; FUTURE;
D O I
10.1186/s40486-019-0094-5
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
We present the selective laser-induced etching (SLE) process and design guidelines for the fabrication of three-dimensional (3D) microfluidic channels in a glass. The SLE process consisting of laser direct patterning and wet chemical etching uses different etch rates between the laser modified area and the unmodified area. The etch selectivity is an important factor for the processing speed and the fabrication resolution of the 3D structures. In order to obtain the maximum etching selectivity, we investigated the process window of the SLE process: the laser pulse energy, pulse repetition rate, and scan speed. When using potassium hydroxide (KOH) as a wet etchant, the maximum etch rate of the laser-modified glass was obtained to be 166 mu m/h, exhibiting the highest selectivity about 333 respect to the pristine glass. Based on the optimized process window, a 3D microfluidic channel branching to three multilayered channels was successfully fabricated in a 4 mm-thick glass. In addition, appropriate design guidelines for preventing cracks in a glass and calibrating the position of the dimension of the hollow channels were studied.
引用
收藏
页数:7
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