Selective laser melting of AlCu-TiB2 alloy using pulsed wave laser emission mode: processability, microstructure and mechanical properties

被引:56
作者
Biffi, Carlo Alberto [1 ]
Bassani, Paola [1 ]
Fiocchi, Jacopo [1 ]
Albu, Mihaela [2 ]
Tuissi, Ausonio [1 ]
机构
[1] CNR, Inst Condensed Matter Chem & Technol Energy, Natl Res Council, ICMATE,Unit Lecco, Via Previati 1-E, I-23900 Lecce, Italy
[2] Graz Ctr Electron Microscopy, Steyrergasse 17, A-8010 Graz, Austria
基金
欧盟地平线“2020”;
关键词
Selective laser melting; Al-Cu-TiB2; alloy; Processability; Microstructure; TEM; EBSD; CU-MG ALLOYS; STRENGTH; PARAMETERS; BEHAVIOR; POWDERS;
D O I
10.1016/j.matdes.2021.109628
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The present work explores the processability of an advanced aluminum alloy, namely AlCu-TiB2, by selective laser melting (SLM), and the correlation between microstructure and mechanical properties of as built specimens. The principal process parameters of the laser emission in pulsed wave (PW) mode, namely laser power and exposure time, were varied to achieve full density parts starting from prealloyed powders. Detailed analysis of defects in the highest relative density conditions was performed thzrough X-ray computed tomography. It was found that the highest relative density, up to 99.5%, was achieved at a laser energy density of 82 J/mm(3). Microstructure of as-built specimens was analyzed through scanning electron microscopy, coupled with EDX and EBSD analyses, and transmission electron microscopy. The as-built microstructure was considerably uniform, and characterized by fine equiaxed grains, decorated with micrometric and nanometric second phases and an even distribution of reinforcing TiB2 particles; no epitaxial grain growth was observed. Finally, tensile behaviour of the as-built specimens indicates a yield and ultimate tensile stress of 325 MPa and 395 MPa, respectively, combined with an elongation of 13%. The low work hardening rate and jerky flow characterizing plastic deformation are analyzed and discussed. (C) 2021 The Authors. Published by Elsevier Ltd.
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页数:11
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