Advanced 2.5D/3D Hetero-Integration Technologies at GINTI, Tohoku University

被引：0
|
作者：
Lee, K. W. [1 ]
Bea, J. C. [1 ]
Koyanagi, M. [1 ]
Fukushima, T. [2 ]
Tanaka, T. [2 ]
机构：
[1] Tohoku Univ, New Ind Creat Hatchery Ctr NICHe, Global Integrat Initiat GINTI, Sendai, Miyagi 9808579, Japan
[2] Tohoku Univ, Dept Biomed Engn, Global Integrat Initiat GINTI, Sendai, Miyagi 9808579, Japan
来源：
2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015) | 2015年
关键词：
3-D heterogeneous integration; chip self-assembly; backside TSV;
D O I：
暂无
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
The Global Integration Initiative (GINTI) is 8/12-inch R&D foundry fab for the research and development of new 2.5D/3D integration technologies and creative applications. GINTI offers a broad range of services to meet the mounting R&D needs of the semiconductor industry and related industries. GINTI provides a cost-competitive process development infrastructure in a manufacturing-like fab environment and a low-cost, short TAT prototyping of proof of concepts using commercial/customized 2D chip/wafer, and a base-line process set-up for the pilot production of creative 3D systems. GINTI aims to provide Tohoku University's advanced 2.5D/3D integration technologies into electronic industries to accelerate the commercialization of innovative 3D technologies and applications into real, manufacturing-ready technology solutions with FAST. This paper introduces advanced 2.5D/3D hetero-integration technologies developed by GINTI/Tohoku University.
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页数：5
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