Thermal spreading resistance of eccentric heat sources on rectangular flux channels

被引：197

作者：

Muzychka, YS ^{[1
]}

Culham, JR

Yovanovich, MM

机构：

[1] Mem Univ Newfoundland, Fac Engn & Appl Sci, St Johns, NF A1B 3X5, Canada

[2] Univ Waterloo, Dept Mech Engn, Microelect Heat Transfer Lab, Waterloo, ON N2L 3G1, Canada

来源：

JOURNAL OF ELECTRONIC PACKAGING | 2003年 / 125卷 / 02期

关键词：

conduction; electronics cooling; heat spreaders; heat sinks; spreading resistance;

D O I：

10.1115/1.1568125

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A general solution, based on the separation of variables method for thermal spreading resistances of eccentric heat sources on a rectangular flux channel is presented. Solutions are obtained for both isotropic and compound flux channels. The general solution can also be used to model any number of discrete heat sources on a compound or isotropic flux channel using superposition. Several special cases involving single and multiple heat sources are presented.

引用

页码：178 / 185

页数：8

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