A 200mW D-band Power Amplifier with 17.8% PAE in 250-nm InP HBT Technology

被引:46
作者
Ahmed, Ahmed S. H. [1 ]
Seo, Munkyo [2 ]
Farid, Ali A. [1 ]
Urteaga, Miguel [3 ]
Buckwalter, James F. [1 ]
Rodwell, Mark J. W. [1 ]
机构
[1] Univ Calif Santa Barbara, Dept Elect & Comp Engn, Santa Barbara, CA 93106 USA
[2] Sungkyunkwan Univ, Dept Elect & Comp Engn, Seoul, South Korea
[3] Teledyne Sci Co, Thousand Oaks, CA 91360 USA
来源
2020 15TH EUROPEAN MICROWAVE INTEGRATED CIRCUITS CONFERENCE (EUMIC) | 2021年
关键词
D-band; millimeter wave; high efficiency; power amplifiers; 250-nm InP; low loss; compact; transmission-line combiner; corporate combiner;
D O I
10.1109/EuMIC48047.2021.00012
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We report a compact and high efficiency D-band power amplifier in 250nm InP HBT technology. A compact and low loss 8:1 transmission line power combiner is demonstrated. The three-stage power amplifier combines 8 capacitively linearized common-base power cells. The amplifier has 23dBm peak power with 17.8% power added efficiency (PAE) and 16.5dB associated large-signal gain at 131GHz. At 131GHz, the smallsignal gain is 21.9dB. The small-signal 3dB-bandwidth is 125.8-145.8GHz. Over the 127-151GHz bandwidth, the saturated output power is greater than 22.3dBm with greater than 15% associated PAE. The amplifier occupies 1.34mm(2) die area and consumes 1.1W DC power. To the authors' knowledge, this result demonstrates a record PAE.
引用
收藏
页码:1 / 4
页数:4
相关论文
共 13 条
[1]  
Ahmed ASH, 2018, 2018 IEEE BICMOS AND COMPOUND SEMICONDUCTOR INTEGRATED CIRCUITS AND TECHNOLOGY SYMPOSIUM (BCICTS), P164, DOI 10.1109/BCICTS.2018.8550924
[2]  
Ahmed ASH, 2018, EUR MICROW INTEGRAT, P29, DOI 10.23919/EuMIC.2018.8539884
[3]  
Ahmed Ahmed S. H., 140GHZ POWER AMPLIFI
[4]  
Bao MQ, 2017, EUR MICROW INTEGRAT, P277
[5]  
Camargo E, 2018, IEEE MTT S INT MICR, P753, DOI 10.1109/MWSYM.2018.8439280
[6]   D-Band and G-Band High-Performance GaN Power Amplifier MMICs [J].
Cwiklinski, Maciej ;
Brueckner, Peter ;
Leone, Stefano ;
Friesicke, Christian ;
Mabler, Hermann ;
Lozar, Roger ;
Wagner, Sandrine ;
Quay, Ruediger ;
Ambacher, Oliver .
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2019, 67 (12) :5080-5089
[7]   Compact Series Power Combining Using Subquarter-Wavelength Baluns in Silicon Germanium at 120 GHz [J].
Daneshgar, Saeid ;
Buckwalter, James F. .
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2018, 66 (11) :4844-4859
[8]   A Broadband Direct Conversion Transmitter/Receiver at D-band Using CMOS 22nm FDSOI [J].
Farid, Ali A. ;
Simsek, Arda ;
Ahmed, Ahmed S. H. ;
Rodwell, Mark J. W. .
2019 IEEE RADIO FREQUENCY INTEGRATED CIRCUITS SYMPOSIUM (RFIC), 2019, :135-138
[9]   A 140-GHz 0.25-W PA and a 55-135 GHz 115-135 mW PA, High-Gain, Broadband Power Amplifier MMICs in 250-nm InP HBT [J].
Griffith, Zach ;
Urteaga, Miguel ;
Rowell, Petra .
2019 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM (IMS), 2019, :1245-1248
[10]  
Griffith Z, 2016, IEEE MTT S INT MICR