Atomic layer deposited aluminum oxide barrier coatings for packaging materials

被引：101

作者：

Hirvikorpi, Terhi ^{[1
]}

Vaha-Nissi, Mika ^{[1
]}

Mustonen, Tuomas ^{[1
]}

Iiskola, Eero ^{[1
]}

Karppinen, Maarit ^{[2
]}

机构：

[1] Cent Lab Ab KCL, Oy Keskuslab, FI-02151 Espoo, Finland

[2] Aalto Univ, Dept Chem, Inorgan Chem Lab, FI-02015 Helsinki, Finland

来源：

THIN SOLID FILMS | 2010年 / 518卷 / 10期

关键词：

Atomic layer deposition; Aluminum oxide; Diffusion barriers; Biodegradable polymers; Polymers; Packaging material; XPS;

D O I：

10.1016/j.tsf.2009.08.025

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Thin aluminum oxide coatings have been deposited at a low temperature of 80 degrees C on various uncoated papers, polymer-coated papers and boards and plain polymer films using the atomic layer deposition (ALD) technique. The work demonstrates that such ALD-grown Al2O3 coatings efficiently enhance the gas-diffusion barrier performance of the studied porous and non-porous materials towards oxygen, water vapor and aromas. (C) 2009 Elsevier B.V. All rights reserved.

引用

页码：2654 / 2658

页数：5