Wafer-level measurement of thermal conductivity on thin films

被引：0

作者：

Roncaglia, Alberto ^{[1
]}

Mancarella, Fulvio ^{[1
]}

Sanmartin, Michele ^{[1
]}

Elmi, Ivan ^{[1
]}

Cardinali, Gian Carlo ^{[1
]}

Severi, Maurizio ^{[1
]}

机构：

[1] CNR, Natl Res Council, Bologna Unit, IMM, I-40126 Bologna, Italy

来源：

2006 IEEE SENSORS, VOLS 1-3 | 2006年

关键词：

D O I：

暂无

中图分类号：

O42 [声学];

学科分类号：

070206 ; 082403 ;

摘要：

A method suited to perform wafer-level measurements of thermal conductivity on thin films by exploiting micromachined test structures is proposed. To this purpose, a measurement procedure able to compensate for instrumental offsets and sensitivity limits typically existing in a standard wafer-level electrical instrumentation, and to eliminate the influence of heat exchange through air is applied. In order to validate the technique, measurements on different thin films of interest in thermal MEMS fabrication are presented (LPCVD polycrystalline silicon, evaporated aluminum, LPCVD silicon oxide).

引用

页码：1239 / +

页数：2

共 6 条

[1] Measurement of thermal conductivity and diffusivity of single and multilayer membranes [J].

Irace, A ;

Sarro, PM .

SENSORS AND ACTUATORS A-PHYSICAL, 1999, 76 (1-3) :323-328

[2] Thermal conductivity measurements on thin films based on micromechanical devices [J].

Jansen, E ;

Obermeier, E .

JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 1996, 6 (01) :118-121

[3] Thermal conductivity of doped polysilicon layers [J].

McConnell, AD ;

Uma, S ;

Goodson, KE .

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2001, 10 (03) :360-369

[4] Process-dependent thin-film thermal conductivities for thermal CMOS MEMS [J].

von Arx, M ;

Paul, O ;

Baltes, H .

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2000, 9 (01) :136-145

[5]

VONARX M, 1998, THESIS ETH ZURICH

[6] An online test microstructure for thermal conductivity of surface-micromachined polysilicon thin films [J].

Xu, GB ;

Huang, QA .

IEEE SENSORS JOURNAL, 2006, 6 (02) :428-433

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