Characterization of n-type layers formed in (11-20)-4H-SiC by phosphorus ion implantation

被引:10
|
作者
Yanagida, N.
Ishibashi, K. [1 ]
Uchiumi, S.
Inada, T.
机构
[1] Hosei Univ, Grad Sch Engn, Koganei, Tokyo 1848584, Japan
[2] Waseda Univ, Nano Technol Res Ctr, Shinjuku Ku, Tokyo 1620041, Japan
关键词
SiC; ion implantation; electrical profile; SIMS profile; RBS;
D O I
10.1016/j.nimb.2007.01.241
中图分类号
TH7 [仪器、仪表];
学科分类号
0804 ; 080401 ; 081102 ;
摘要
Phosphorus ions have been implanted in p-type, (11-20)-oriented 414-SiC to fabricate highly doped n-type layers, with a box-shaped electrical profile, in the substrate. It has been shown that an implantation-induced amorphous layer epitaxially re-crystallizes during annealing at 1000 degrees C. Electrical profile measurements have been successfully made on samples annealed at/above 1200 degrees C. An similar to 100 nm-thick n-type layer, uniformly doped at carrier concentrations of similar to 1 x 10(20) cm(-3), is formed after annealing at 1500 degrees C and an extremely low resistivity of 1.4 x 10(-3) ohm CM is achieved in the P-implanted layer. It is also demonstrated that a considerable large number of P atoms are lost from the substrate during annealing above 1400 degrees C. The surface morphology of P-implanted 4H-SiC is deteriorated when annealed at 1600 degrees C. (C) 2007 Elsevier B.V. All rights reserved.
引用
收藏
页码:203 / 207
页数:5
相关论文
共 50 条
  • [1] Aluminum-ion implantation into 4H-SiC (11-20) and (0001)
    Negoro, Y
    Kimoto, T
    Matsunami, H
    SILICON CARBIDE 2004-MATERIALS, PROCESSING AND DEVICES, 2004, 815 : 217 - 222
  • [2] Characterization of phosphorus implantation in 4H-SiC
    Khemka, V
    Patel, R
    Ramungul, N
    Chow, TP
    Ghezzo, M
    Kretchmer, J
    JOURNAL OF ELECTRONIC MATERIALS, 1999, 28 (03) : 167 - 174
  • [3] Characterization of phosphorus implantation in 4H-SiC
    V. Khemka
    R. Patel
    N. Ramungul
    T. P. Chow
    M. Ghezzo
    J. Kretchmer
    Journal of Electronic Materials, 1999, 28 : 167 - 174
  • [4] Electrical activation of implanted phosphorus ions in [0001]- and [11-20]-oriented 4H-SiC
    Schmid, F
    Laube, M
    Pensl, G
    Wagner, G
    Maier, M
    JOURNAL OF APPLIED PHYSICS, 2002, 91 (11) : 9182 - 9186
  • [5] Impurity concentration dependence of recrystallization process of phosphorus implanted 4H-SiC(11-20)
    Satoh, M.
    Suzuki, T.
    SILICON CARBIDE AND RELATED MATERIALS 2005, PTS 1 AND 2, 2006, 527-529 : 799 - 802
  • [6] Epitaxial growth and characterization of 4H-SiC(11-20) and (03-38)
    Kimoto, T
    Hashimoto, K
    Fujihira, K
    Danno, K
    Nakamura, S
    Negoro, Y
    Matsunami, H
    SILICON CARBIDE 2002-MATERIALS, PROCESSING AND DEVICES, 2003, 742 : 3 - 13
  • [7] Characterization of 167 MeV Xe ion irradiated n-type 4H-SiC
    Madito, M. J.
    Hlatshwayo, T. T.
    Skuratov, V. A.
    Mtshali, C. B.
    Manyala, N.
    Khumalo, Z. M.
    APPLIED SURFACE SCIENCE, 2019, 493 : 1291 - 1298
  • [8] Process Optimisation for <11-20> 4H-SiC MOSFET applications
    Blanc, C.
    Tournier, D.
    Godignon, P.
    Brink, D. J.
    Souliere, V.
    Camassel, J.
    SILICON CARBIDE AND RELATED MATERIALS 2005, PTS 1 AND 2, 2006, 527-529 : 1051 - 1054
  • [9] Impact of Al-Ion Implantation on the Formation of Deep Defects in n-Type 4H-SiC
    Weisse, Julietta
    Csato, Constantin
    Hauck, Martin
    Erlekampf, Jurgen
    Akhmadaliev, Shavkat
    Rommel, Mathias
    Mitlehner, Heinz
    Rueb, Michael
    Krieger, Michael
    Bauer, Anton
    Haeublein, Volker
    Erlbacher, Tobias
    Frey, Lothar
    2018 22ND INTERNATIONAL CONFERENCE ON ION IMPLANTATION TECHNOLOGY (IIT 2018), 2018, : 66 - 69
  • [10] Al Implantation and Post Annealing Effects in n-Type 4H-SiC
    Son, Woo-Young
    Shin, Myeong-Cheol
    Schweitz, Michael
    Lee, Sang-Kwon
    Koo, Sang-Mo
    JOURNAL OF NANOELECTRONICS AND OPTOELECTRONICS, 2020, 15 (07) : 777 - 782