Analysis of the three-dimensional delamination behavior of stretchable electronics applications

被引:0
作者
van der Sluis, O. [1 ,3 ]
Timmermans, P. H. M. [1 ]
van der Zanden, E. J. L. [2 ]
Hoefnagels, J. P. M. [2 ]
机构
[1] Philips Appl Technol, High Tech Campus 7, NL-5656 AE Eindhoven, Netherlands
[2] Eindhoven Univ Technol, Dept Mech Engn, Eindhoven 5600, MB, Netherlands
[3] Delft Univ Technol, Dept Precis & Microsyst Engn, Delft 2628, CD, Netherlands
来源
ADVANCES IN FRACTURE AND DAMAGE MECHANICS VIII | 2010年 / 417-418卷
关键词
Stretchable electronics; delamination; peel test; fracture mechanics; cohesive zone modeling; thin films; INTERCONNECTS;
D O I
暂无
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Stretchable electronics offer potential application areas in biological implants interacting with human tissue, while also facilitating increased design freedom in electronics. A key requirement on these products is the ability to withstand large deformations during usage without losing their integrity. Experimental observations show that delamination between the metal conductor lines and the stretchable substrate may eventually lead to short circuits while also the delaminated area could result in cohesive failure of the metal lines. Interestingly, peel tests show that the rubber is severely lifted at the delamination front caused by its high compliance. To quantify the interface in terms of cohesive zone properties, these parameters are varied such that the experimental and numerical peel-force curve and rubber-lift geometry at the delamination front match. The thus obtained interface properties are used to simulate the delamination behavior of actual three-dimensional stretchable electronics samples loaded in tension.
引用
收藏
页码:9 / +
页数:2
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