The redistributed chip package: A breakthrough for advanced packaging

被引：53

作者：

Keser, Beth ^{[1
]}

Amrine, Craig ^{[1
]}

Duong, Trung ^{[1
]}

Fay, Owen ^{[1
]}

Hayes, Scott ^{[1
]}

Leal, George ^{[1
]}

Lytle, William ^{[1
]}

Mitchell, Doug ^{[1
]}

Wenzel, Robert ^{[1
]}

机构：

[1] Freescale Semicond, 2100 E Elliot Rd,MD EL725, Tempe, AZ 85284 USA

来源：

57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS | 2007年

关键词：

D O I：

10.1109/ECTC.2007.373811

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The Redistributed Chip Package (RCP) is a substrate-less embedded chip package that offers a low-cost, high performance, integrated alternative to current wirebond BGA and flip. chip BGA packaging. Devices are encapsulated into panels while routing of signals, power, and ground is built directly on the panel. The RCP panel and signal build-up lowers the cost of the package by eliminating wafer bumping and substrates thereby enabling large scale assembly in panel form. The build-up provides better routing capabilities and better integration. Also, by eliminating bumping, the device interconnect is inherently Pb-free, and the stress of the package is reduced enabling ultra-low K device compatibility. The panel is created by, attaching device active side down to a substrate, encapsulating and curing the devices, grinding to desired thickness, and then removing the substrate. Signal, power, and ground planes are created, using redistribution-like processing. Multi-layer metal RCP packages have passed -40 to 125C air-to-air thermal cycling and HAST after MSL3/260 preconditioning.

引用

页码：286 / +

页数：3