共 50 条
- [2] On cure induced stresses in low cure temperature thermoset polymer composites 43RD INTERNATIONAL SAMPE SYMPOSIUM AND EXHIBITION ON MATERIALS AND PROCESS AFFORDABILITY - KEYS TO THE FUTURE, VOL 43, 1998, : 199 - 213
- [4] Stress evolution during thermoset cure ELECTRONIC PACKAGING MATERIALS SCIENCE X, 1998, 515 : 195 - 202
- [7] A review of numerical simulation of cure-induced distortions and residual stresses in thermoset composites Li, Shuxin (lishuxin@whut.edu.cn), 1600, Beijing University of Aeronautics and Astronautics (BUAA) (34): : 471 - 485
- [9] MODELING RHEOLOGICAL AND DIELECTRIC-PROPERTIES DURING THERMOSET CURE ADVANCES IN CHEMISTRY SERIES, 1990, (227): : 235 - 248
- [10] MODELING THE RHEOLOGICAL AND DIELECTRIC-PROPERTIES DURING THERMOSET CURE ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1988, 196 : 207 - PMSE