An investigation of the deposition of ceria on silica by quartz crystal microbalance: Observations on the effect of many body interactions

被引:4
作者
Borujeny, E. Rafie [1 ]
Miao, M. [1 ]
Pirayesh, H. [1 ]
Xu, Z. [1 ]
Cadien, K. [1 ]
机构
[1] Univ Alberta, Dept Chem & Mat Engn, Edmonton, AB T6G 1H9, Canada
关键词
Deposition rate; Particle-particle interactions; Surface-particle interactions; Electrochemical properties; DLVO theory; Silica ceria interaction; COLLOID PARTICLES; HYDRODYNAMIC INTERACTIONS; POROUS-MEDIA; ADSORPTION; SURFACE; NANOPARTICLES; LIQUID; ENVIRONMENT; RESONATOR; STABILITY;
D O I
10.1016/j.colsurfa.2017.02.081
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
Interaction of ceria and silica is important in a wide variety of applications such as Chemical Mechanical Polish (CMP). In this work, a Quartz Crystal Microbalance (QCM) and mathematical modeling and simulations are used to investigate the dynamics of the attachment of ceria and silica under different flow rate, colloid concentration and pH conditions. The well-known DLVO forces of interaction were successfully used to distinguish between favorable and unfavorable conditions for the attachment of ceria and silica, and to develop a cleaning procedure to obtain reproducible data when using QCM for studying charged particles. The use of the optimized cleaning procedure as well as careful selection of the experimental conditions such as flow rate and concentration led to the important experimental observation that deposition of ceria particles onto silica surface is affected by many body particle-particle interactions in the bulk that can hinder the ability of the ceria particles to successfully attach to the silica surface. These experimental results could not be predicted by using a convection-diffusion-migration model which incorporates a single particle-surface DLVO interaction energy but ignores particle-particle interactions in the bulk. This is an important finding that permits the determination of the proper conditions for applications such as CMP and post CMP cleaning. (C) 2017 Elsevier B.V. All rights reserved.
引用
收藏
页码:207 / 217
页数:11
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