Fabrication of Si3N4 ceramics with high thermal conductivity and flexural strength via novel two-step gas-pressure sintering

被引:36
作者
Hu, Jiabin [1 ]
Zhang, Bo [1 ]
Li, Cong [1 ]
Wang, Laili [2 ]
Wang, Shenghe [3 ]
Shi, Zhongqi [1 ]
Yang, Jianfeng [1 ]
机构
[1] Xi An Jiao Tong Univ, State Key Lab Mech Behav Mat, Xian 710049, Peoples R China
[2] Xi An Jiao Tong Univ, Sch Elect Engn, Xian 710049, Peoples R China
[3] State Grid Anhui Elect Power Co Ltd, Hefei 230061, Anhui, Peoples R China
基金
中国国家自然科学基金;
关键词
Silicon nitride; Gas-pressure sintering; Bimodal microstructure; Thermal conductivity; Flexural strength; IMPROVED FRACTURE-TOUGHNESS; BONDED SILICON-NITRIDE; MICROSTRUCTURAL DESIGN; ADDITIVES; POWDER; SI;
D O I
10.1016/j.jeurceramsoc.2022.04.049
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Si3N4 ceramic substrates serving as heat dissipater and supporting component are required to have excellent thermal and mechanical properties. To prepare Si3N4 with desirable properties, a novel two-step gas-pressure sintering route including a pre-sintering step followed by a high-temperature sintering step was devised. The effects of pre-sintering temperature (1500 - 1600 degrees C) on the phase transformation, microstructure, thermal and mechanical properties of the samples were studied. The pre-sintering temperature played an important role in adjusting the Si3N4 particles' rearrangement and alpha -> B transformation rate. Furthermore, the densification process for the Si3N4 ceramics prepared via the two-step gas-pressure sintering was revealed. After sintered at 1525 degrees C for 3 h followed by a high-temperature sintering at 1850 degrees C for another 3 h, the prepared Si3N4 compact with a bimodal microstructure presented the highest thermal conductivity and flexural strength of 79.42 W center dot m- 1 center dot K-1 and 801 MPa, respectively, which holds great application prospects as ceramic substrates.
引用
收藏
页码:4846 / 4854
页数:9
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