共 25 条
- [1] Benzler T., 2001, THESIS
- [2] Braun T, 2016, 2016 12TH INTERNATIONAL CONGRESS MOLDED INTERCONNECT DEVICES (MID), P62
- [4] Cho BR, 2009, J CERAM PROCESS RES, V10, P121
- [5] Forschungsvereinigung raumliche elektronische Baugruppen 3-D MID e. V.: 3D-MID technology: Spatial electronic assem-blies: Manufacturing process, 2004, FORSCH RAUML ELEKT B
- [6] Franke J., 2013, 3 DIMENSIONAL MOLDED
- [7] Franke J., 2011, MID STUDY 2011 MARKE
- [8] German R.M., 1997, Powder Metall., V42, P157
- [10] Islam A., 2014, P 4 INT C NAN NANOMA