Three-dimensional (3D) visualization of reflow porosity and modeling of deformation in Pb-free solder joints

被引：43

作者：

Dudek, M. A. ^{[1
]}

Hunter, L. ^{[2
]}

Kranz, S. ^{[1
]}

Williams, J. J. ^{[1
]}

Lau, S. H. ^{[2
]}

Chawla, N. ^{[1
]}

机构：

[1] Arizona State Univ, Sch Mat, Fulton Sch Engn, Tempe, AZ 85287 USA

[2] Xradia Inc, Concord, CA USA

来源：

MATERIALS CHARACTERIZATION | 2010年 / 61卷 / 04期

关键词：

X-ray tomography; 3D materials science; Porosity; Finite element method (FEM); MICROSTRUCTURE; BEHAVIOR; INTERMETALLICS;

D O I：

10.1016/j.matchar.2010.01.011

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The volume, size, and dispersion of porosity in solder joints are known to affect mechanical performance and reliability Most of the techniques used to characterize the three-dimensional (3D) nature of these defects are destructive With the enhancements in high resolution computed tomography (CT), the detection limits of intrinsic microstructures have been significantly improved Furthermore, the 3D microstructure of the material can be used in finite element models to understand their effect on microscopic deformation In this paper we describe a technique utilizing high resolution (<1 mu m) X-ray tomography for the three-dimensional (3D) visualization of pores in Sn-3 9Ag-0 7Cu/Cu joints The characteristics of reflow porosity, including volume fraction and distribution, were investigated for two reflow profiles The size and distribution of porosity size were visualized in 3D for four different solder joints In addition, the 3D virtual microstructure was incorporated into a finite element model to quantify the effect of voids on the lap shear behavior of a solder joint The presence, size, and location of voids significantly increased the seventy of strain localization at the solder/copper interface (C) 2010 Elsevier Inc All rights reserved

引用

页码：433 / 439

页数：7

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