Embedded passives in organic substrate for bluetooth transceiver module

被引：15

作者：

Li, L ^{[1
]}

Bowles, P ^{[1
]}

Hwang, LT ^{[1
]}

Plager, S ^{[1
]}

机构：

[1] Motorola Inc, Semicond Prod Sector, Tempe, AZ 85284 USA

来源：

53RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2003 PROCEEDINGS | 2003年

关键词：

D O I：

10.1109/ECTC.2003.1216319

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

A Bluetooth(TM) RF transceiver module comprises the RF transceiver die, its external matching components, switches, filters, and other components to fulfill the complete RF radio function, which can be used for short-range communications in cellular phones, PDAs, and computer network applications. Typically Low Temperature Co-fired Ceramic (LTCC) substrate is used for this application, due to its capability to embed passives, which reduces the module size. In this paper, the authors focused on embedding passives; in organic substrate, which is in general more cost effective, A band pass filter (BPF), balun, matching network inductor, and decoupling caps were embedded successfully in the organic substrate, which dramatically reduced module size and Costa and resulted in size competitive modules comparing to LTCC.

引用

页码：464 / 469

页数：6