Parametric Macromodeling of Lossy and Dispersive Multiconductor Transmission Lines

被引：12
|
作者：
Ferranti, Francesco [1 ]
Antonini, Giulio [2 ]
Dhaene, Tom [1 ]
Knockaert, Luc [1 ]
机构：
[1] Ghent Univ IBBT, Dept Informat Technol INTEC, B-9000 Ghent, Belgium
[2] Univ Aquila, Dipartimento Ingn Elettr & Informaz, UAq EMC Lab, I-67040 Laquila, Italy
来源：
IEEE TRANSACTIONS ON ADVANCED PACKAGING | 2010年 / 33卷 / 02期
关键词：
Interconnects; parametric macromodeling; rational approximation; transient analysis; MODEL ORDER REDUCTION; TRANSIENT ANALYSIS; RATIONAL APPROXIMATION; PASSIVE MACROMODELS; SIMULATION; INTERCONNECTS; ALGORITHM; NETWORKS; CIRCUITS;
D O I：
10.1109/TADVP.2009.2027892
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
We propose an innovative parametric macromodeling technique for lossy and dispersive multiconductor transmission lines (MTLs) that can be used for interconnect modeling. It is based on a recently developed method for the analysis of lossy and dispersive MTLs extended by using the multivariate orthonormal vector fitting (MOVF) technique to build parametric macromodels in a rational form. They take into account design parameters, such as geometrical layout or substrate features, in addition to frequency. The presented technique is suited to generate state-space models and synthesize equivalent circuits, which can be easily embedded into conventional SPICE-like solvers. Parametric macromodels allow to perform design space exploration, design optimization, and sensitivity analysis efficiently. Numerical examples validate the proposed approach in both frequency and time domain.
引用
收藏
页码：481 / 491
页数：11
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