Frequency domain reflectometry of plasma chambers

被引:3
|
作者
Law, V. J. [1 ]
Macgearailt, N.
Cunningham, P.
机构
[1] Dublin City Univ, Sch Phys Sci, Natl Ctr Plasma Sci & Technol, Dublin 9, Ireland
[2] Intel Ireland Ltd, Leixlip, Kildare, Ireland
关键词
plasma tool diagnostic; fault detection; classification;
D O I
10.1016/j.vacuum.2006.11.004
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Frequency domain reflectometry (FDR) is used to compare the electrical characteristics of five industrial plasma chambers, without the plasma present, used in the manufacture of semiconductors devices at Intel-Ireland. A scalar network analyzer (SNA), consisting of a tracking generator/spectrum analyzer and a radio frequency bridge was used to sweep the chambers from 1 MHz to 1 GHz. The non-invasive nature of the measurement interrogates the matching network, the wafer platen electrode fringing capacitance to ground, and radio frequency resistive loss. The resulting frequency response gives a unique fingerprint of the chamber, and is completely transferable between chambers for post-maintenance qualification and chamber comparison. The results from three electron cyclotron resonance (ECR) chambers are compared with the two single-frequency capacitively coupled plasma chambers and one dual-frequency inductively coupled plasma chamber. A comparative chamber survey of the three ECR chambers reveals a strong wafer electrode reflection in the 500 MHz frequency region. Whereas, for slab-like plasma chamber designs (such as the LRC Rainbow 4400 chamber) the wafer electrode response is at 14-15 MHz. It is found that the chamber design and individual components have a unique frequency response. A linear analogue circuit simulator was used to verify and characterize the measurements. (c) 2006 Elsevier Ltd. All rights reserved.
引用
收藏
页码:958 / 968
页数:11
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