ON-State Gate Stress Induced Threshold Voltage Instabilities in p-GaN Gate AlGaN/GaN HEMTs

被引:7
作者
Stockman, Arno [1 ]
Moens, Peter [1 ]
机构
[1] ON Semicond Belgium, CRD, Oudenaarde, Belgium
来源
2020 IEEE INTERNATIONAL INTEGRATED RELIABILITY WORKSHOP (IIRW) | 2020年
关键词
gallium nitride (GaN); enhancement mode (e-mode); high-electron-mobility transistor (HEMT); p-GaN gate; conduction mechanism; threshold voltage stability; technology computer-aided design (TCAD); SHIFT;
D O I
10.1109/IIRW49815.2020.9312869
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this study, the transient threshold voltage behavior of p-GaN capped AlGaN/GaN high-electron-mobility transistors (HEMTs) is evaluated, by monitoring the threshold voltage from 10 mu s up to 100 s during positive gate bias stress, as well as during recovery. It is found that the threshold voltage transients are highly dependent on the current distribution in the metal/p-GaN/AlGaN/GaN gate stack. Two different gate processes are evaluated in terms of os-state gate current, gate conduction mechanism and threshold voltage stability. Devices with perimeter-dependent gate current show large threshold voltage shifts; devices in which the gate current is due to uniform thermionic (field) emission over the Schottky interface into the bulk p-GaN demonstrate stable behavior for V-g < 5 V.
引用
收藏
页码:12 / 15
页数:4
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