Conductive adhesives for low-stress interconnection of thin back-contact solar cells

被引：10

作者：

Eikelboom, DWK ^{[1
]}

Bultman, JH ^{[1
]}

Schönecker, A ^{[1
]}

Meuwissen, MHH ^{[1
]}

van den Nieuwenhof, MAJC ^{[1
]}

Meier, DL ^{[1
]}

机构：

[1] ECN Solar Energy, NL-1755 ZG Petten, Netherlands

来源：

CONFERENCE RECORD OF THE TWENTY-NINTH IEEE PHOTOVOLTAIC SPECIALISTS CONFERENCE 2002 | 2002年

关键词：

D O I：

10.1109/PVSC.2002.1190544

中图分类号：

TE [石油、天然气工业]; TK [能源与动力工程];

学科分类号：

0807 ; 0820 ;

摘要：

Thin crystalline silicon solar cells cannot be interconnected with standard soldering techniques because of warping and breakage. Interconnection with conductive adhesives showed excellent behavior warping can be avoided and 80mum thin cells do not break during and after interconnection. Contact resistances measured on glued interconnections are similar to soldered contacts. Damp/heat tests show no degradation after 2500 hours at 85degreesC/85% humidity. Temperature cycling -40/+80degreesC has shown no effects after 200 cycles. I-V measurements of interconnected thin back-contact cells in mini modules show no loss in fill factor. Test mini modules made with soldered back contacts and glued front contacts show excellent performance even after over 900 cycles. Interconnection with conductive adhesives is a promising technique combining excellent mechanical properties, good conductivity, durability, and low process temperatures thus reducing stress.

引用

页码：403 / 406

页数：4