Thermal analysis of hybrid aluminium metal matrix composites

被引:3
作者
Sangeetha, M. [1 ]
Joy, Nivin [1 ]
Adhisheshan, G. Sriram [1 ]
Kennady, J. Arul [1 ]
Kamalinee, S. [1 ]
Bashaa, Shaik Burans Mahaboob [1 ]
机构
[1] Sathyabama Inst Sci Technol, Sch Mech Engn, Chennai 600119, Tamil Nadu, India
关键词
Electronic packaging; Liquid infiltration process; Melting point; Thermal diffusivity; Thermal coefficient of expansion;
D O I
10.1016/j.matpr.2020.12.341
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this work the thermal properties of hybrid metal matrix composites are analyzed. Thermal analysis of composite materials is essential for electronic devices. Thermal analysis of hybrid metal matrix composites is applied in electronic packaging. The property proposed to be assessed within are increased endurance limit, increased productivity, energizing, low maintenance cost and benefit to the surroundings such as less noise, less airborne emissions. Packaging material should have considerable aspects such as deplorably low thermal coefficient of expansion, high thermal conductivity, and low cost, low density with good mechanical properties. The hybrid composites are fabricated by liquid in filtration process and subjected to thermal studies such as thermal diffusivity, thermal coefficient of expansion and melting point. (c) 2020 Elsevier Ltd. All rights reserved. Selection and peer-review under responsibility of the scientific committee of the 3rd International Conference on Frontiers in Automobile & Mechanical Engineering.
引用
收藏
页码:3846 / 3850
页数:5
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