Dynamic influence on contact failure

被引：0

作者：

Xu, LJ ^{[1
]}

机构：

[1] Beijing Univ Posts & Telecommun, Res Lab Elect Contacts, Beijing 100876, Peoples R China

来源：

IEICE TRANSACTIONS ON ELECTRONICS | 2003年 / E86C卷 / 06期

关键词：

contact failure; vibration; micromotion;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Nowadays electronic devices and systems are widely used in various dynamic environments. However, they cause electrical contact instability that can easily be ignored. This phenomenon is considered as contact failure caused by a dynamic influence. In this paper, the investigation of contact failure caused by dynamic influences and analysis method for such contact failure are discussed. The results show that a dynamic influence could not be well covered in the experimental testing for a new product.

引用

页码：963 / 967

页数：5