Chemical deposition of copper sulfide films in the surface of polyamide by the use of higher polythionic acids

被引：36

作者：

Janickis, V ^{[1
]}

Maciuleviciuse, R ^{[1
]}

Ivanauskas, R ^{[1
]}

Ancutiene, I ^{[1
]}

机构：

[1] Kaunas Univ Technol, Fac Chem Technol, LT-3028 Kaunas, Lithuania

来源：

COLLOID AND POLYMER SCIENCE | 2003年 / 281卷 / 01期

关键词：

polyamide; polythionic acids; sulfuration; diffusion; copper sulfide films;

D O I：

10.1007/s00396-002-0732-x

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

Films of copper sulfides of varying composition are formed in a surface matrix of polyamide by a sorption-diffusion method using solutions of higher polythionic acids, H2SnO6 (n > 6), as sulfuring agents. A film of nonstoichiometric CuxS (x = 1.06-1.95) is obtained when the sulfured polyamide is treated with a solution of Cu(I-II) salt. The value of x in CuxS decreases with the prolongation of the period of polyamide sulfuration in the H2SnO6 solution and increases with the prolongation of the period of sulfured polyamide interaction with the copper salt solution. The films obtained are formed from two main phases: yarrowite (Cu1.12S) and anilite (Cu1.75S). Depending on the polyamide sulfuration and the sulfured polyamide interaction with a solution of Cu(I-II) salt conditions, CuxS films on polyamide of different electrical conductivity were obtained. The sulfide with a composition close to CuS has the highest electrical conductivity.

引用

页码：84 / 89

页数：6

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