Characteristics of the Sn-Pb eutectic solder bump formed via fluxless laser reflow soldering

被引：25

作者：

Lee, JH ^{[1
]}

Park, D

Moon, JT

Lee, YH

Shin, DH

Kim, YS

机构：

[1] Hongik Univ, Dept Met & Mat Sci, Seoul, South Korea

[2] Hyundai Elect Ind, Device & Semicond Res Div, Kyonggi Do, South Korea

[3] Hanyang Univ, Dept Met & Mat Sci, Ansan, South Korea

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2000年 / 29卷 / 10期

关键词：

fluxless soldering; laser reflow solder bumping; energy input rate; solder disk; shear strength;

D O I：

10.1007/s11664-000-0006-7

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In an attempt to develop a fluxless reflow solder bumping process, the effects of processing variables, which include energy input rate and time, and the shape of solder disk on the microstructure of the solder/Cu pad interface and the shear strength of the joints were investigated. It was demonstrated that a proper combination of the variables could lead to the formation of a spherical solder bump with shear strength comparable to that formed via the conventional reflow soldering process. In addition, the kinetics of Cu pad dissolution into the solder during laser heating was modeled numerically to elucidate intermetallic formation mechanism at the solder/Cu pad interface.

引用

页码：1153 / 1159

页数：7

共 21 条

[1]

Brinkmann U, 1998, LASER FOCUS WORLD, V34, P24

[2] A fluxless bonding technology using indium-silver multilayer composites [J].