AI-Powered Terahertz VLSI Testing Technology for Ensuring Hardware Security and Reliability

被引:9
作者
Akter, Naznin [1 ]
Siddiquee, Masudur R. [1 ]
Shur, Michael [2 ,3 ,4 ]
Pala, Nezih [1 ]
机构
[1] Florida Int Univ, Dept Elect & Comp Engn, Miami, FL 33174 USA
[2] Rensselaer Polytech Inst, Dept Elect Comp & Syst Engn, Troy, NY 12180 USA
[3] Rensselaer Polytech Inst, Dept Phys Appl Phys & Astron, Troy, NY 12180 USA
[4] Elect Future Inc, Vienna, VA 22181 USA
来源
IEEE ACCESS | 2021年 / 9卷 / 09期
关键词
Integrated circuits; Testing; Imaging; Pins; Convolution; Hardware; Frequency measurement; Terahertz; hardware cybersecurity; reliability; authentication; deep learning; convolution neural network; artificial intelligence; INSPECTION; RADIATION; DEVICE;
D O I
10.1109/ACCESS.2021.3075429
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
Hardware cybersecurity has become a key issue, especially for very large integrated circuits. If counterfeit, forged, or defective ICs present a significant threat to system reliability and security. The growing complexity of digital and mixed-signal systems makes it increasingly challenging yet vital to develop robust methods to assess and confirm the reliability and authenticity of ICs. We introduce a new terahertz testing method for non-destructive and unobtrusive identification of counterfeit, damaged, forged or defective ICs by measuring their response to incident terahertz and sub-terahertz radiation at the circuit pins and analyzing the response using artificial intelligence (AI). These responses create unique signatures for ICs. We generated 2D images by measuring the response on a selected pin of a radio frequency IC (RFIC) scanned by a focused terahertz radiation. By applying the data augmentation processes, we created a secure image data set to train the convolutional neural network (CNN) model. An unsecured image data set representing altered or damaged ICs was generated by modifying the original image data. The trained models identified secure devices with a similar to 94% accuracy.
引用
收藏
页码:64499 / 64509
页数:11
相关论文
共 76 条
[1]   Quality control and authentication of packaged integrated circuits using enhanced-spatial-resolution terahertz time-domain spectroscopy and imaging [J].
Ahi, Kiarash ;
Shahbazmohamadi, Sina ;
Asadizanjani, Navid .
OPTICS AND LASERS IN ENGINEERING, 2018, 104 :274-284
[2]   Terahertz Characterization of Electronic Components and Comparison of Terahertz Imaging with X-ray Imaging Techniques [J].
Ahi, Kiarash ;
Asadizanjani, Navid ;
Shahbazmohamadi, Sina ;
Tehranipoor, Mark ;
Anwar, Mehdi .
TERAHERTZ PHYSICS, DEVICES, AND SYSTEMS IX: ADVANCED APPLICATIONS IN INDUSTRY AND DEFENSE, 2015, 9483
[3]  
Angrisani L, 2016, NEW TRENDS AND DEVELOPMENTS IN METROLOGY, P21, DOI 10.5772/63734
[4]  
[Anonymous], 2011, Microelectronics Failure Analysis Desk Reference
[5]   An Overview of Non-Destructive Testing Methods for Integrated Circuit Packaging Inspection [J].
Aryan, Pouria ;
Sampath, Santhakumar ;
Sohn, Hoon .
SENSORS, 2018, 18 (07)
[6]   Terahertz image segmentation using k-means clustering based on weighted feature learning and random pixel sampling [J].
Ayech, Mohamed Walid ;
Ziou, Djemel .
NEUROCOMPUTING, 2016, 175 :243-264
[7]   Advanced Processing Sequence for 3-D THz Imaging [J].
Balacey, Hugo ;
Recur, Benoit ;
Perraud, Jean-Baptiste ;
Sleiman, Joyce Bou ;
Guillet, Jean-Paul ;
Mounaix, Patrick .
IEEE TRANSACTIONS ON TERAHERTZ SCIENCE AND TECHNOLOGY, 2016, 6 (02) :191-198
[8]   The modeling peculiarities of diffractive propagation of the broadband terahertz two-dimensional field [J].
Balbekin, N. S. ;
Kulya, M. S. ;
Rogov, P. Yu. ;
Petrov, N. V. .
4TH INTERNATIONAL CONFERENCE OF PHOTONICS AND INFORMATION OPTICS, PHIO 2015, 2015, 73 :49-53
[9]  
Breitenstein O., 2002, ISTFA 2002. Proceedings of the 28th International Symposium for Testing and Failure Analysis, P29
[10]   A novel defect detection technique using active transient thermography for high density package and interconnections [J].
Chai, TC ;
Wong, BS ;
Bai, WM ;
Trigg, A ;
Lam, YK .
53RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2003 PROCEEDINGS, 2003, :920-925