New Epoxy Composite Thermosets With Enhanced Thermal Conductivity and High Tg Obtained by Cationic Homopolymerization

被引：24

作者：

Isarn, Isaac ^{[1
]}

Gamardella, Francesco ^{[2
]}

Massagues, Lluis ^{[3
]}

Fernandez-Francos, Xavier ^{[4
]}

Serra, Angels ^{[2
]}

Ferrando, Francesc ^{[1
]}

机构：

[1] Univ Rovira & Virgili, Dept Mech Engn, E-43007 Tarragona, Spain

[2] Univ Rovira & Virgili, Dept Analyt & Organ Chem, E-43007 Tarragona, Spain

[3] Univ Rovira & Virgili, Dept Elect Elect & Automat Engn, E-43007 Tarragona, Spain

[4] Univ Politecn Cataluna, Thermodynam Lab, ETSEIB, E-08028 Barcelona, Spain

来源：

POLYMER COMPOSITES | 2018年 / 39卷

关键词：

BENZYLAMMONIUM SALTS; BORON-NITRIDE; ELECTRICAL-CONDUCTIVITY; POLYMER COMPOSITES; NANOCOMPOSITES; STRENGTH; FILLERS; RESINS; ETHER;

D O I：

10.1002/pc.24774

中图分类号：

TB33 [复合材料];

学科分类号：

摘要：

Thermal dissipation is a critical aspect for the performance and lifetime of electronic devices. In this work, novel composites based on a cycloaliphatic epoxy matrix and BN fillers, obtained by cationic curing of mixtures of 3,4-epoxy cyclohexylmethyl 3,4-epoxy cyclohexane carboxylate (ECC) with several amounts of hexagonal boron nitride (BN) were prepared and characterized. As cationic initiator a commercial benzylanilinium salt was used, which by addition of triethanolamine, exhibited an excellent latent character and storage stability. The effect of the formulation composition was studied by calorimetry and rheological measurements. The variation of thermal conductivity, thermal stability, thermal expansion coefficient, and thermomechanical and mechanical properties of the composites with the load of BN filler (ranging from 10 to 40 wt%) was evaluated. An improvement of an 800% (1.04 W/m.K) in thermal conductivity was reached in materials with glass transition temperatures >200 degrees C without any loss in electrical insulation. (C) 2018 Society of Plastics Engineers

引用

页码：E1760 / E1769

页数：10

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