Long-wavelength two-dimensional WDM vertical cavity surface-emitting laser arrays fabricated by nonplanar wafer bonding

被引:8
作者
Geske, J [1 ]
Okuno, YL
Leonard, D
Bowers, JE
机构
[1] Univ Calif Santa Barbara, Dept Elect & Comp Engn, Santa Barbara, CA 93106 USA
[2] Gore Photon, Lompoc, CA 93436 USA
关键词
optical fiber communication; optical pumping; semiconductor lasers; surface-emitting lasers; wafer bonding; wafer-scale integration; wavelength-division multiplexing (WDM);
D O I
10.1109/LPT.2002.806101
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We demonstrate the first, long-wavelength two-dimensional wavelength-division-multiplexed vertical cavity surface-emitting laser array. The eight-channel single-mode array covers the C-band from 1532 to 1565 nm. The devices are fabricated using two separate active regions laterally integrated using nonplanar wafer bonding. We achieved single-mode powers up to 0.8 mW, 2-dB output power uniformity across the array, and sidemode suppression ratios in excess of 43 dB. This fabrication technique can be used to maintain the gain-peak and cavity-mode alignment across wide-band arrays and, with the use of nontraditional mirrors, can be extended to the fabrication of arrays covering the entire C-, S-, and L-bands as well as the 1310-nin transmission band.
引用
收藏
页码:179 / 181
页数:3
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