Impact of Ni-coated carbon fiber on the interfacial (Cu,Ni)6Sn5 growth of Sn-3.5Ag composite solder on Cu substrate during reflow and isothermal aging

In this work, a novel composite solder was fabricated by mechanically incorporating Ni-coated carbon fiber (NiCF) into the Sn-3.5Ag solder paste in an effort to improve the overall service capability, where the intermetallic compound (IMC) formation and growth is a fundamental issue for consideration. General findings indicated that the addition of Ni-CF did not significantly impact the processing properties of the base alloy, such as melting temperature and wettability, when the reinforcement fraction was less than 2 wt%. Isothermal aging tests were carried out to study the formation and growth of interfacial IMC layers between the composite solder and Cu substrate. The addition of Ni-CF into Sn-3.5Ag solder could effectively promote the formation of interfacial (Cu, Ni)(6)Sn-5 phase during reflow but retard its growth in the solid-state aging. The addition of 1 wt% Ni-CF was believed to be more effective to restrict and reduce the subsequent growth rate of the IMCs during solid-state aging due to the initial formation of a thicker (Cu, Ni)(6)Sn-5 layer after reflow.