The Influences of Dopants on Lead Free Solder Alloy

被引：1
作者：
Efzan, Ervina M. N. [1 ,2 ]
Faziera, Nur M. N. [1 ]
Abdullah, Mohd Mustafa Al Bakri [3 ]
机构：
[1] Multimedia Univ, Fac Engn & Technol, Ayer Keroh 75450, Malacca, Malaysia
[2] Univ Malaysia Perlis, Ctr Excellence Geopolymer & Green Technol CeGeoGT, Sch Mat Engn, Perlis, Malaysia
[3] Univ Malaysia Perlis, Fac Engn Technol, Perlis, Malaysia
来源：
ADVANCED MATERIALS ENGINEERING AND TECHNOLOGY V | 2017年 / 1835卷
关键词：
SN-1.0AG-0.5CU SOLDER; MECHANICAL-PROPERTIES; MICROSTRUCTURE; CREEP; PROPERTY;
D O I：
10.1063/1.4981842
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Doping of solder alloys give interest because it's favorably to modify the characteristics of solder in the molten and solid states. Many researchers have studied on the dopant additions on lead free solder alloys and results an enhancement in characteristics of the solder alloys. In this paper, a review of using dopants that has become widespread to enhance shock/drop reliability was discussed.
引用
收藏
页数：3
相关论文
共 17 条
[1]   Lead-free solders in microelectronics [J].
Abtew, M ;
Selvaduray, G .
MATERIALS SCIENCE & ENGINEERING R-REPORTS, 2000, 27 (5-6) :95-141
[2]  
Amares S., 2015, MATEC WEB C, V27
[3]   Effect of Different Aging Times on Sn-Ag-Cu Solder Alloy [J].
Efzan, Ervina M. N. ;
Norfarhani, Siti, I .
TRANSACTIONS ON ELECTRICAL AND ELECTRONIC MATERIALS, 2015, 16 (03) :112-116
[4]  
Efzan Mohd Noor Ervina, 2016, Materials Science Forum, V857, P22, DOI 10.4028/www.scientific.net/MSF.857.22
[5]   Influence of Zn addition on the microstructure, melt properties and creep behavior of low Ag-content Sn-Ag-Cu lead-free solders [J].
El-Daly, A. A. ;
Hammad, A. E. ;
Al-Ganainy, G. S. ;
Ragab, M. .
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2014, 608 :130-138
[6]   Structural characterization and creep resistance of nano-silicon carbide reinforced Sn-1.0Ag-0.5Cu lead-free solder alloy [J].
El-Daly, A. A. ;
Al-Ganainy, G. S. ;
Fawzy, A. ;
Younis, M. J. .
MATERIALS & DESIGN, 2014, 55 :837-845
[7]   Novel SiC nanoparticles-containing Sn-1.0Ag-0.5Cu solder with good drop impact performance [J].
El-Daly, A. A. ;
Fawzy, A. ;
Mansour, S. F. ;
Younis, M. J. .
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2013, 578 :62-71
[8]   Thermal analysis and mechanical properties of Sn-1.0Ag-0.5Cu solder alloy after modification with SiC nano-sized particles [J].
El-Daly, A. A. ;
Fawzy, A. ;
Mansour, S. F. ;
Younis, M. J. .
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2013, 24 (08) :2976-2988
[9]  
Ervina E.E., 2008, P IEEE CPMT INT EL M, DOI [10.1109/IEMT.2008.5507865, DOI 10.1109/IEMT.2008.5507865]
[10]  
Ervina E. M. N., 2012, EL MAN TECHN S IEMT, P1, DOI DOI 10.1109/IEMT.2012.6521780
12