Polymeric materials for electronics packaging

被引：0
|
作者：
Liu, J [1 ]
机构：
[1] Chalmers Univ Technol, SE-41296 Gothenburg, Sweden
来源：
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | 2000年 / 23卷 / 03期
关键词：
D O I：
10.1109/TCAPT.2000.868838
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
[No abstract available]
引用
收藏
页码：419 / 419
页数：1
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