SELECTIVE ELECTROLESS NICKEL PLATING ON OXYGEN-PLASMA-ACTIVATED GOLD SEED-LAYERS FOR THE FABRICATION OF LOW CONTACT RESISTANCE VIAS AND MICROSTRUCTURES

被引：5

作者：

Fischer, A. C. ^{[1
]}

Lapisa, M. ^{[1
]}

Roxhed, N. ^{[1
]}

Stemme, G. ^{[1
]}

Niklaus, F. ^{[1
]}

机构：

[1] KTH Royal Inst Technol, Stockholm, Sweden

来源：

MEMS 2010: 23RD IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST | 2010年

关键词：

SILICON;

D O I：

10.1109/MEMSYS.2010.5442462

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper presents a novel technique to selectively deposit nickel by electroless plating on gold seed layers using an oxygen-plasma-activation step. No prior wet surface pre- treatments or metal oxide etches are required. This enables the manufacturing of low-resistance vias for heterogeneous three-dimensional (3D) integration of MEMS but it is also a suitable technique for the fabrication of arbitrary shaped nickel-microstructures using chemically stable and cost-effective electroless nickel plating baths.

引用

页码：472 / 475

页数：4

共 10 条

[1] ALMEIDA L, 2006, P SPIE, V6111
[2] Baudrand D., 1995, MET FINISH, V93, P55
[3] Electroless plating of nickel on silicon for fabrication of high-aspect-ratio microstructures
Furukawa, S
Mehregany, M
[J]. SENSORS AND ACTUATORS A-PHYSICAL, 1996, 56 (03) : 261 - 266
[4] Garrou P., 2008, HDB 3D INTEGRATION T, P153
[5] Electroless nickel bumping of aluminum bondpads - Part I: Surface pretreatment and activation
Hutt, DA
Liu, CQ
Conway, PP
Whalley, DC
Mannan, SH
[J]. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2002, 25 (01): : 87 - 97
[6] Effects of nickel and palladium activations on the adhesion and I-V characteristics of as-plated electroless nickel deposits on polished crystalline silicon
Karmalkar, S
Kumar, VP
[J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2004, 151 (09) : C554 - C558
[7] Mallory G., 1990, Electroless Plating: Fundamentals and Applications, P1
[8] Wafer bonding with nano-imprint resists as sacrificial adhesive for fabrication of silicon-on-integrated-circuit (SOIC) wafers in 3D integration of MEMS and ICs
Niklaus, Frank
Decharat, Adit
Forsberg, Fredrik
Roxhed, Niclas
Lapisa, Martin
Populin, Michael
Zimmer, Fabian
Lemm, Joern
Stemme, Goeran
[J]. SENSORS AND ACTUATORS A-PHYSICAL, 2009, 154 (01) : 180 - 186
[9] Selective electroless nickel plating on polyelectrolyte multilayer platforms
Wang, TC
Chen, B
Rubner, MF
Cohen, RE
[J]. LANGMUIR, 2001, 17 (21) : 6610 - 6615
[10] Micromechanical switches fabricated using nickel surface micromachining
Zavracky, PM
Majumder, S
McGruer, NE
[J]. JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 1997, 6 (01) : 3 - 9

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