Hygro-thermo-mechanical behavior of molding compounds at elevated environments

被引：0

作者：

Yi, S ^{[1
]}

Yu, ZY ^{[1
]}

Neo, R ^{[1
]}

Lee, YJ ^{[1
]}

机构：

[1] Portland State Univ, Dept Mech Engn, Portland, OR 97207 USA

来源：

54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS | 2004年

关键词：

D O I：

10.1109/ECTC.2004.1319334

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this study, the time, temperature and moisture dependent properties of polymer molding compounds used for plastic IC packages are investigated experimentally. The moisture absorption in the molding compound is determined at various environmental conditions. The creep behaviors of molding compounds are measured at various temperatures below the glass transition and at various humidity conditions. The experimental results show that moisture content and temperature significantly affect the mechanical behavior of the material. The increase of moisture content results in increasing the magnitudes of strains remarkably. The time function of its compliance is also characterized and the shift function is evaluated.

引用

页码：180 / 185

页数：6

共 11 条

[1] [Anonymous], 1964, ENG DESIGN PLASTICS
[2] ANALYSIS OF INTERLAMINAR STRESSES IN VISCOELASTIC COMPOSITES
LIN, KY
YI, S
[J]. INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, 1991, 27 (07) : 929 - 945
[3] MIX DE, 1995, P ADV EL PACK, P539
[4] NGUYEN LT, 1995, ELEC COMP C, P478, DOI 10.1109/ECTC.1995.515324
[5] SAWADA K, 1994, P INT REL PHYS S, P114
[6] SHOOK RL, 1992, INT REL PHY, P157, DOI 10.1109/RELPHY.1992.187641
[7] Residual stresses in plastic IC packages during surface mounting process preceded by moisture soaking test
Yi, S
Goh, JS
Yang, JC
[J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1997, 20 (03): : 247 - 255
[8] THERMOVISCOELASTIC ANALYSIS OF DELAMINATION ONSET AND FREE-EDGE RESPONSE IN LAMINATED COMPOSITES
YI, S
[J]. AIAA JOURNAL, 1993, 31 (12) : 2320 - 2328
[9] Cooling rate effect on post cure stresses in molded plastic IC packages
Yi, S
Sze, KY
[J]. JOURNAL OF ELECTRONIC PACKAGING, 1998, 120 (04) : 385 - 390
[10] YI S, 1995, P 5 INT S PHYS FAIL, P11

← 1 2 →