Diffusive transport in supercritical CO2 drying of MEMS structures

被引:1
作者
Resnick, PJ [1 ]
Hankins, MG [1 ]
机构
[1] Sandia Natl Labs, Albuquerque, NM 87123 USA
来源
RELIABILITY, TESTING, AND CHARACTERIZATION OF MEMS/MOEMS II | 2003年 / 4980卷
关键词
MEMS; diffusion; Supercritical; CO2; drying; stiction;
D O I
10.1117/12.478208
中图分类号
TH7 [仪器、仪表];
学科分类号
0804 ; 080401 ; 081102 ;
摘要
Supercritical CO2 drying has been shown to be an effective method for drying complex MEMS structures with little or no stiction. This process typically involves transferring released parts from ultrapure water into a solvent, such as methanol, that is miscible with liquid CO2, and subsequently displacing the methanol with liquid CO2. During this process sequence, transport of methanol into and out of the tortuous pathways of the MEMS device is dominated by diffusion. The non-steady state diffusion equation (Fick's second law) with length scales relevant to MEMS structures can be applied to understand the speed at which diffusion occurs. This analysis indicates that diffusion of methanol into the pathways of a MEMS device occurs very rapidly, typically on the order of minutes. Experimental data are consistent with the rapid diffusion hypothesis.
引用
收藏
页码:229 / 237
页数:9
相关论文
共 12 条
  • [1] BEYER WH, 1987, STANDARD MATH TABLES, P551
  • [2] Bird R. B., 1960, TRANSPORT PHENOMENA, P96
  • [3] Surface micromachining for microelectromechanical systems
    Bustillo, JM
    Howe, RT
    Muller, RS
    [J]. PROCEEDINGS OF THE IEEE, 1998, 86 (08) : 1552 - 1574
  • [4] CARSLAW HS, 1986, CONDUCTION HEAT SOLI, P96
  • [5] FOGLER HS, 1986, ELEMENTS CHEM REACTI, P560
  • [6] Tortuous flow in porous media
    Koponen, A
    Kataja, M
    Timonen, J
    [J]. PHYSICAL REVIEW E, 1996, 54 (01): : 406 - 410
  • [7] LIDE DR, 1990, HDB CHEM PHYSICS, pA101
  • [8] OZISIK MN, 1980, HEAT CONDUCTION, P30
  • [9] PERRY RH, 1984, CHEM ENG HDB, P20
  • [10] Whole wafer critical point drying of MEMS devices
    Resnick, PJ
    Clews, PJ
    [J]. RELIABILITY, TESTING AND CHARACTERIZATION OF MEMS/MOEMS, 2001, 4558 : 189 - 196