Electrodeposition of nickel-phosphorus from a highly conductive citrate bath for wire bonding applications

被引：4

作者：

Dadvand, M. ^{[5
]}

Dadvand, N. ^{[1
,2
,3
,6
]}

Kipouros, G. J. ^{[4
,6
]}

机构：

[1] St Gobain, Northborough, MA USA

[2] Connect Tyco Elect, Elect, Harrisburg, PA USA

[3] USAE Connect Tyco Elect, Harrisburg, PA USA

[4] Univ Saskatchewan, Coll Engn, 57 Campus Dr, Saskatoon, SK S7N 5A9, Canada

[5] Energ Mareriaux Telecommun Res Ctr, 1650 Blvd Lionel Boulet, Varennes, PQ J3X 1S2, Canada

[6] Dalhousie Univ, Mat Engn Proc Engn & Appl Sci, 1360 Barrington St,Room F201, Halifax, NS B3H 4R2, Canada

来源：

CANADIAN METALLURGICAL QUARTERLY | 2016年 / 55卷 / 01期

关键词：

Electroplating; Nickel-phosphorus; Conductivity; Wire bonding; Citrate; Coating; ELECTROPLATED NI-P;

D O I：

10.1179/1879139515Y.0000000029

中图分类号：

TF [冶金工业];

学科分类号：

0806 ;

摘要：

A highly conductive electrolytic nickel-phosphorus (Ni-P) plating bath was formulated as an alternative to electroless Ni-P deposition for aluminium wire bonding application. The Ni-P deposits were electroplated from nickel citrate baths containing sodium chloride, citric acid, nickel sulphate and sodium hypophosphite (SHP) using the DC plating. In comparison with Watts bath, the formulated highly conductive citrate bath had almost twice of cathodic current efficiency in low-current density regions and exhibited more uniform plating thickness. In addition, the formulated citrate bath did not have any boric acid as a component; and hence, eliminating the waste disposal issue related to boric acid.

引用

页码：1 / 12

页数：12

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