Tensile and fatigue strength of solder joints in titanium.

被引:0
|
作者
Bae, TS
Kim, TJ
Choi, JH
Park, CW
Ohkawa, S
Kondo, S
Watari, F
机构
[1] CHONBUK UNIV,CHONJU,SOUTH KOREA
[2] HOKKAIDO UNIV,SAPPORO,HOKKAIDO 060,JAPAN
关键词
D O I
暂无
中图分类号
R78 [口腔科学];
学科分类号
1003 ;
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页码:344 / 344
页数:1
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