A Mo/n-type 6H-SiC/Ni Schottky barrier diode (SBD) was fabricated by sputtering Mo metal on n-type 6H-SiC semiconductor. Before the formation of Mo/n-type 6H-SiC SBD, an ohmic contact was formed by thermal evaporation of Ni on n-type 6H-SiC and annealing at 950 degrees C for 10 min. It was seen that the structure had excellent rectification. The electrical parameters were extracted using its current-voltage (I-V) and capacitance-voltage (C-V) measurements carried out at room temperature. Very high (1.10 eV) barrier height and 1.635 ideality factor values were reported for Mo/n-type 6H-SiC using In plot. The barrier height and series resistance values of the diode were also calculated as 1413 eV and 69 Omega from Norde's functions, respectively. Furthermore, 1.938 eV barrier height value of Mo/n-type 6H-SiC SBD calculated from C-V measurements was larger than the one obtained from I-V data. (C) 2014 Elsevier Ltd. All rights reserved.
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Department of Physics, University of Port Elizabeth, PO Box 1600, Port Elizabeth 6000, South AfricaDepartment of Physics, University of Port Elizabeth, PO Box 1600, Port Elizabeth 6000, South Africa
Samiji, M.E.
Van Wyk, E.
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Department of Physics, University of Port Elizabeth, PO Box 1600, Port Elizabeth 6000, South AfricaDepartment of Physics, University of Port Elizabeth, PO Box 1600, Port Elizabeth 6000, South Africa
Van Wyk, E.
Wu, L.
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Department of Physics, University of Port Elizabeth, PO Box 1600, Port Elizabeth 6000, South AfricaDepartment of Physics, University of Port Elizabeth, PO Box 1600, Port Elizabeth 6000, South Africa
Wu, L.
Venter, A.
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Department of Physics, Vista University, Private Bag X 613, Port Elizabeth, South AfricaDepartment of Physics, University of Port Elizabeth, PO Box 1600, Port Elizabeth 6000, South Africa
Venter, A.
Leitch, A.W.R.
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Department of Physics, University of Port Elizabeth, PO Box 1600, Port Elizabeth 6000, South AfricaDepartment of Physics, University of Port Elizabeth, PO Box 1600, Port Elizabeth 6000, South Africa
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Microelectronics School,Xidian University
Key Laboratory of Wide Band Gap Semiconductor Materials and Devices,Xidian UniversityMicroelectronics School,Xidian University
郭辉
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赵亚秋
张玉明
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Key Laboratory of Wide Band Gap Semiconductor Materials and Devices,Xidian UniversityMicroelectronics School,Xidian University
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Xidian Univ, Microelect Sch, Xian 710071, Shaanxi, Peoples R China
Xidian Univ, Key Lab Wide Band Gap Semicond Mat & Devices, Xian 710071, Shaanxi, Peoples R ChinaXidian Univ, Microelect Sch, Xian 710071, Shaanxi, Peoples R China
Guo Hui
Zhao Yaqiu
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Xidian Univ, Microelect Sch, Xian 710071, Shaanxi, Peoples R ChinaXidian Univ, Microelect Sch, Xian 710071, Shaanxi, Peoples R China
Zhao Yaqiu
Zhang Yuming
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Xidian Univ, Key Lab Wide Band Gap Semicond Mat & Devices, Xian 710071, Shaanxi, Peoples R ChinaXidian Univ, Microelect Sch, Xian 710071, Shaanxi, Peoples R China
Zhang Yuming
Ling Xianbao
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Xidian Univ, Microelect Sch, Xian 710071, Shaanxi, Peoples R ChinaXidian Univ, Microelect Sch, Xian 710071, Shaanxi, Peoples R China
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Chinese Acad Sci, Shanghai Inst Ceram, Shanghai 201800, Peoples R China
Chinese Acad Sci, Grad Univ, Beijing 100049, Peoples R ChinaChinese Acad Sci, Shanghai Inst Ceram, Shanghai 201800, Peoples R China
Zhou Tian-Yu
Liu Xue-Chao
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Chinese Acad Sci, Shanghai Inst Ceram, Shanghai 201800, Peoples R ChinaChinese Acad Sci, Shanghai Inst Ceram, Shanghai 201800, Peoples R China
Liu Xue-Chao
Huang Wei
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Chinese Acad Sci, Shanghai Inst Ceram, Shanghai 201800, Peoples R ChinaChinese Acad Sci, Shanghai Inst Ceram, Shanghai 201800, Peoples R China
Huang Wei
Zhuo Shi-Yi
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Chinese Acad Sci, Shanghai Inst Ceram, Shanghai 201800, Peoples R ChinaChinese Acad Sci, Shanghai Inst Ceram, Shanghai 201800, Peoples R China
Zhuo Shi-Yi
Zheng Yan-Qing
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Chinese Acad Sci, Shanghai Inst Ceram, Shanghai 201800, Peoples R ChinaChinese Acad Sci, Shanghai Inst Ceram, Shanghai 201800, Peoples R China
Zheng Yan-Qing
Shi Er-Wei
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Chinese Acad Sci, Shanghai Inst Ceram, Shanghai 201800, Peoples R ChinaChinese Acad Sci, Shanghai Inst Ceram, Shanghai 201800, Peoples R China