Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder

被引：38

作者：

Jiang, Nan ^{[1
]}

Zhang, Liang ^{[1
]}

Liu, Zhi-quan ^{[2
]}

Sun, Lei ^{[3
]}

Xiong, Ming-yue ^{[1
]}

Zhao, Meng ^{[1
]}

Xu, Kai-kai ^{[1
]}

机构：

[1] Jiangsu Normal Univ, Sch Mechatron Engn, Xuzhou 221116, Jiangsu, Peoples R China

[2] Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China

[3] Nanjing Univ Aeronaut & Astronaut, Natl Key Lab Sci & Technol Helicopter Transmiss, Nanjing 210016, Jiangsu, Peoples R China

来源：

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | 2019年 / 30卷 / 19期

基金：

国家重点研发计划; 中国博士后科学基金;

关键词：

LEAD-FREE SOLDER; MECHANICAL-PROPERTIES; INTERFACE REACTION; SN-AG; ADDITIONS;

D O I：

10.1007/s10854-019-02107-0

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this paper, the influences of adding Titanium (Ti) nanoparticles on melting characteristics, wettability, shear properties and the growth of interfacial intermetallic compounds (IMC) of Sn58Bi solder were investigated. The results show that the addition of Ti nanoparticles improved the wettability and shear strength of Sn58Bi solder, and the optimum additive content was 0.1 wt%. The microstructure of the Sn58Bi solder was refined obviously with the addition of Ti nanoparticles. The thickness of interfacial IMC reduced significantly by adding Ti nanoparticles. However, doping Ti nanoparticles had the slight effect on the melting temperature of Sn58Bi solder. Moreover, the thickness of IMC at the Sn58Bi/Cu interface was distinctly larger than that of Sn58Bi-0.1Ti/Cu solder after multiple reflows, which means that the addition of Ti nanoparticles could suppress the growth of IMC at solder/Cu interface during multiple reflows.

引用

页码：17583 / 17590

页数：8

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