Advanced LSI packaging technologies

被引：0
作者：
Hiraiwa, K [1 ]
Minamizawa, M [1 ]
机构：
[1] Fujitsu Ltd, Kawasaki, Kanagawa, Japan
来源：
FUJITSU SCIENTIFIC & TECHNICAL JOURNAL | 2000年 / 36卷 / 01期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Mobile devices need to be small, and the packages of most chips have been miniaturized as much as possible in order to meet this need. The Chip Size/Scale Package (CSP) was realized in the 1990s, and Fujitsu, as one of the pioneers in this area, has supplied various CSPs. This paper describes the structure, characteristics, and reliability of Fujitsu's CSPs. Then, a package for high-speed devices is described.
引用
收藏
页码：99 / 107
页数：9
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