An Investigation of the Wear on Silicon Surface at High Humidity

被引:4
作者
Wang, Xiaodong [1 ,2 ]
Guo, Jian [2 ,3 ]
Xu, Lin [1 ]
Cheng, Guanggui [1 ]
Qian, Linmao [2 ]
机构
[1] Jiangsu Univ, Ctr Micro Nano Sci & Technol, Zhenjiang 212013, Peoples R China
[2] Southwest Jiaotong Univ, Tribol Res Inst, State Key Lab Tract Power, Chengdu 610031, Sichuan, Peoples R China
[3] Univ South China, Sch Mech Engn, Hengyang 421000, Peoples R China
来源
MATERIALS | 2018年 / 11卷 / 06期
基金
中国博士后科学基金; 中国国家自然科学基金;
关键词
monocrystalline silicon; wear; high humidity; etch; FORCE; WATER; DEPENDENCE; FRICTION; CONTACTS; ADHESION; BEHAVIOR; MODEL; TEM;
D O I
10.3390/ma11061027
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
Using an atomic force microscope (AFM), the wear of monocrystalline silicon (covered by a native oxide layer) at high humidity was investigated. The experimental results indicated that tribochemistry played an important role in the wear of the silicon at different relative humidity levels (RH = 60%, 90%). Since the tribochemical reactions were facilitated at 60% RH, the wear of silicon was serious and the friction force was around 1.58 N under the given conditions. However, the tribochemical reactions were restrained when the wear pair was conducted at high humidity. As a result, the wear of silicon was very slight and the friction force decreased to 0.85 N at 90% RH. The slight wear of silicon at high humidity was characterized by etching tests. It was demonstrated that the silicon sample surface was partly damaged and the native oxide layer on silicon sample surface had not been totally removed during the wear process. These results may help us optimize the tribological design of dynamic microelectromechanical systems working in humid conditions.
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页数:10
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