Woven fabric-based electrical circuits - Part II: Yarn and fabric structures to reduce crosstalk noise in woven fabric-based circuits

被引:33
作者
Dhawan, A [1 ]
Ghosh, TK [1 ]
Seyam, AM [1 ]
Muth, JF [1 ]
机构
[1] N Carolina State Univ, Coll Text, Raleigh, NC 27695 USA
关键词
D O I
10.1177/004051750407401103
中图分类号
TB3 [工程材料学]; TS1 [纺织工业、染整工业];
学科分类号
0805 ; 080502 ; 0821 ;
摘要
One important problem in electronic textiles is crosstalk and lack of signal integrity between conductive lines. Two significant advantages of electronic textiles over traditional circuit boards are flexibility and the ability to scale to large areas. Capacitive and inductive crosstalk is aggravated by long parallel conductors, and varies as the electronic textile is flexed into different configurations. This paper evaluates crosstalk between woven parallel conductors. Two new thread structures-coaxial and twisted pair copper threads-to minimize cross talk are developed and evaluated. Significant reductions in crosstalk are obtained with the coaxial and twisted pair thread structures when compared with bare copper threads or insulated conductive threads.
引用
收藏
页码:955 / 960
页数:6
相关论文
共 8 条
  • [1] BAKOGLU HK, 1987, INTERCONNECTIONS PAC
  • [2] DHAWAN A, 2002, P TEXT TECHN FOR IFA
  • [3] DHAWAN A, 2001, THESIS N CAROLINA ST
  • [4] GREGORY RV, 1990, Patent No. 5162135
  • [5] KUHN HH, 1987, Patent No. 4803096
  • [6] POON RK, 1994, COMPUTER CIRCUITS EL
  • [7] TEWKSBURY ST, 1994, MICROELECTRONIC SYST
  • [8] Young B., 2001, Digital signal integrity: modeling and simulation with interconects and packages