Electrodeposition and morphology analysis of Bi-Te thermoelectric alloy nanoparticles on copper substrate

被引：15
作者：
Gan, Yong X. [1 ]
Sweetman, James [1 ]
Lawrence, Joseph G. [2 ]
机构：
[1] Univ Toledo, Coll Engn, Dept Mech Ind & Mfg Engn, Toledo, OH 43606 USA
[2] Univ Toledo, Coll Engn, Dept Bioengn, Toledo, OH 43606 USA
来源：
MATERIALS LETTERS | 2010年 / 64卷 / 03期
关键词：
Thermoelectricity; Nanomaterials; Electrodeposition; Morphology; Energy dispersive X-ray spectrum; THIN-FILMS; MERIT; NANOSTRUCTURES; NANOWIRES; FIGURE;
D O I：
10.1016/j.matlet.2009.11.045
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Nanoscale Bi-Te particles with thermoelectric properties on copper substrate were investigated. The substrate was prepared by electroplating copper layer on a copper zinc alloy plate in a copper Sulfate solution. Electrodeposition of the Bi-Te alloy particles was then performed in a nitrate bath. The electrolyte is composed of 0.05 M bismuth nitrate and 0.01 M tellurium dioxide dissolved in 2.0 M HNO(3). Cyclic voltammetry and quartz microbalance tests associated with the electrodeposition process were conducted to show the mechanism and kinetics of the deposition. The morphology and compositional analysis of Bi-Te was obtained using scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDS) respectively. The morphology analysis suggested that nanoscale Bi-Te particles were obtained and the EDS results indicated that the surface of the copper substrate contained Cu(2)O. The atomic ratio 1:1 for Bi:Te in the alloy, which is equivalent to the weight percentage of Bi:Te=62%:38% was confirmed from the data obtained. (C) 2009 Elsevier B.V. All rights reserved.
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收藏
页码：449 / 452
页数：4
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