EMC Simulation of a Power Filter in the Automotive Area

被引:0
作者
Silaghi, Andrei-Marius [1 ]
Bleoju, Ciprian [2 ]
De Sabata, Aldo [1 ]
机构
[1] Univ Politehn Timisoara, Dept Measurements & Opt Elect, Timisoara, Romania
[2] Univ Politehn Timisoara, Dept Mech, Qualificat Labs, Timisoara, Romania
来源
2021 IEEE 27TH INTERNATIONAL SYMPOSIUM FOR DESIGN AND TECHNOLOGY IN ELECTRONIC PACKAGING (SIITME 2021) | 2021年
关键词
CST Microwave Studio; Return loss; Insertion loss; EMC 3D Simulation; S parameters;
D O I
10.1109/SIITME53254.2021.9663636
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The PoC (Power over Coax) approach is increasing in popularity because of the high speed and sophistication of interfaces in cars, thus allowing the superimposing of signals and power in one coaxial cable. A filter of this type is used on the circuit side to separate the signal and the power supply currents. This paper addresses the aforementioned promising topic, by studying in a 3D Simulation a PoC Filter EMC performance. The contribution is demonstrated by the step-by-step guidance on how to tackle EMC environment of a PoC Filter (this topic has not been addressed in the literature so far). The novelty sterns from calculating return loss and insertion loss for this type of filters and from comparisons that are made between 3D and Schematic simulations (using CST PCB Studio and CST Microwave Studio).
引用
收藏
页码:29 / 32
页数:4
相关论文
共 7 条
  • [1] [Anonymous], 2019, TECH NOTES
  • [2] [Anonymous], 2018, POW OV COAX DES GUID
  • [3] [Anonymous], 2014, SEND POW COA DS90UB9
  • [4] De Sabata A., 2020, EMC EUROPE
  • [5] EMC Simulation of an Automotive Ethernet Interface
    Silaghi, Andrei-Marius
    De Sabata, Aldo
    [J]. 2020 14TH INTERNATIONAL SYMPOSIUM ON ELECTRONICS AND TELECOMMUNICATIONS (ISETC), 2020, : 103 - 106
  • [6] Subrt L., POWER OVER COAX FILT
  • [7] High Bandwidth and Multi-Channel Power over Coaxial Filters for Automotive Low-Voltage Differential Signaling Interconnect
    Uematsu, Yutaka
    Sakamoto, Hideyuki
    [J]. 2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020), 2020, : 1749 - 1756