Polymer thick film technology for realization of fine line structures on different substrates

被引：0

作者：

Detert, Markus ^{[1
]}

Rebenklau, Lars ^{[2
]}

Zerna, Thomas ^{[1
]}

Wolter, Klaus-Juergen ^{[1
,2
]}

机构：

[1] Tech Univ Dresden, Ctr Microtech Mfg, Dresden, Germany

[2] Tech Univ Dresden, Elect Packaging Lab, Dresden, Germany

来源：

2006 29TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY | 2006年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The Polymer-Thick-Film-Technology (PTF) is a potential solution for realizing interconnections on substrates under consideration of some special aspects. Such aspects are the production costs and environmental requirements. This paper will analyze the printable resolution of up-to-date PTF pastes, the conductivity and the reliability of the realized structures. Therefore the technological properties of the pastes applied on flexible and rigid substrates are analyzed. It is shown that it is possible to realize structures with lines widths < 100 mu m and vias with diameters < 200 mu m using PTF Technology. Furthermore the development of new materials allows the screen printing of high conductivity structures.

引用

页码：353 / +

页数：2