Soft Devices for High-Resolution Neuro-Stimulation: The Interplay Between Low-Rigidity and Resolution

被引:8
作者
Vebraite, Ieva [1 ]
Hanein, Yael [1 ]
机构
[1] Tel Aviv Univ, Sch Elect Engn, Tel Aviv, Israel
来源
FRONTIERS IN MEDICAL TECHNOLOGY | 2021年 / 3卷
基金
以色列科学基金会;
关键词
neurostimulation; prosthesis; electrode substrate; electrode adhesion; multi electrode arrays; SHAPE-MEMORY POLYMERS; ELECTRICAL-STIMULATION; RETINAL PROSTHESIS; SILK FIBROIN; HIGH-DENSITY; LARGE-SCALE; IMPLANTABLE MICROELECTRODES; BIOMEDICAL APPLICATIONS; SELECTIVE STIMULATION; MULTIELECTRODE ARRAY;
D O I
10.3389/fmedt.2021.675744
中图分类号
R318 [生物医学工程];
学科分类号
0831 ;
摘要
The field of neurostimulation has evolved over the last few decades from a crude, low-resolution approach to a highly sophisticated methodology entailing the use of state-of-the-art technologies. Neurostimulation has been tested for a growing number of neurological applications, demonstrating great promise and attracting growing attention in both academia and industry. Despite tremendous progress, long-term stability of the implants, their large dimensions, their rigidity and the methods of their introduction and anchoring to sensitive neural tissue remain challenging. The purpose of this review is to provide a concise introduction to the field of high-resolution neurostimulation from a technological perspective and to focus on opportunities stemming from developments in materials sciences and engineering to reduce device rigidity while optimizing electrode small dimensions. We discuss how these factors may contribute to smaller, lighter, softer and higher electrode density devices.
引用
收藏
页数:23
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