Simulating the stress-strain state of a thin plate after a thermal shock

被引：1

作者：

Sedelnikov, A. V. ^{[1
]}

Glushkov, S. V. ^{[1
]}

Serdakova, V. V. ^{[2
]}

Evtushenko, M. A. ^{[1
]}

Khnyryova, E. S. ^{[1
]}

机构：

[1] Samara Natl Res Univ, 34 Moskovskoye Shosse, Samara 443086, Samarskaya Obla, Russia

[2] Amur State Univ, 21 Ignatyevskoye Shosse, Blagoveshchensk 675027, Amurskaya Oblas, Russia

来源：

INTERNATIONAL JOURNAL OF MODELING SIMULATION AND SCIENTIFIC COMPUTING | 2022年 / 13卷 / 03期

关键词：

Thermal shock; thin plate; stress-strain state; temperature field;

D O I：

10.1142/S1793962322500246

中图分类号：

TP301 [理论、方法];

学科分类号：

081202 ;

摘要：

The paper is devoted to simulating the impact of a thermal shock on a thin homogeneous plate in the ANSYS package. The assessment of the stress-strain state is carried out and the dynamics of changes in the temperature field of the plate is determined. The obtained results were compared with the data of other authors and can be used when taking into account the thermal shock of large elastic elements of spacecraft.

引用

页数：10

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